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https://drivepatents.com/patents/979895 · 8 Jan 2014
There is provided a single chip igniter such that it is possible to realize a reduction in operating voltage, an increase in noise tolerance, a reduction in size, and a reduction in cost. By reducing the gate threshold voltage of a MOS transistor 1, and re...
https://drivepatents.com/patents/980911 · 18 Dec 2013
An object is to determine a current limit level most suitable to a drive system for a hybrid automobile or an electric automobile so that a DC-side capacitor is prevented from being broken down when an inverter is stopped in an emergency during high-speed ...
https://drivepatents.com/patents/982857 · 23 Oct 2013
There is provided an igniting semiconductor device such that it is possible to reliably prevent burning of an IGBT or ignition coil L, and erroneous ignition, even when reducing the size of a capacitor that generates a self-interrupting circuit time consta...
https://drivepatents.com/patents/986544 · 25 Sep 2013
An AC-AC converter configured of a forward converter that converts alternating current to direct current and a reverse converter that converts direct current to alternating current, wherein a first semiconductor switch series circuit, a second semiconducto...
https://drivepatents.com/patents/986645 · 18 Sep 2013
An object of the present invention is to provide a semiconductor device in which the collector current Ic of the output stage IGBT does not oscillate in the operating processes of a self shut down circuit and a current control circuit, and thus the ignitio...
https://drivepatents.com/patents/994717 · 26 Dec 2012
Provided is a power converter that is capable of ensuring a necessary conduction current without expanding the configuration of a DC voltage conversion circuit such as a DC chopper. Power can be supplied from both a DC chopper (6) and a voltage source rect...
https://drivepatents.com/patents/1000252 · 18 Jul 2012
A method of manufacturing a semiconductor apparatus according to the invention includes the steps of: coating solder 31 on an predetermined area in the upper surface of lead frame 30; mounting chip 32 on solder 31; melting solder 31 with hot plate 33 for b...
https://drivepatents.com/patents/1082027 · 1 Dec 2004
The power supply has a DC power source (3) and parallel and serial converters (4,6) which are parallel connected between ends of an electrolytic capacitor (Cdc). The parallel and serial converters are actuated so that parallel converter current (Ipara) is ...