A cooling bond pad (102, 200, 500) and methods are disclosed. A plurality of internal-cooling channels (112) cool the cooling bond pad (102, 200, 500), and an internal-flow channel (208) is coupled to the internal-cooling channels (112), and directs an int...

A component has an outer wall (110) defining an interior chamber to be cooled. Electronic equipment (42) is mounted within the outer wall in the chamber. A thermoelectric cooler (29) has a cool node (30) positioned to be within the chamber, and a hot node ...